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Taiwan Semiconductor Manufacturing Company Limited stock analysis TSM.US

Taiwan Semiconductor Manufacturing Company Limited (TSMC) is primarily a dedicated semiconductor foundry focused on manufacturing integrated circuits for its customers rather than designing or selling chips under its own brand. It offers manufacturing services across a wide spectrum of process nodes - from advanced logic nodes like 2-nanometer (N2), 3-nanometer (N3, including enhanced versions like N3E, N3P, N3X) and 5-nanometer (N5/N5P), to more mature nodes such as 16nm, 28nm, 12-nanometer (12FFC+), and specialty processes including analog, radio frequency (RF), high voltage, embedded non-volatile memory (NVM), and image sensors.

Beyond pure transistor manufacturing, TSMC provides related semiconductor fabrication services under a broader "Foundry 2.0" definition that includes mask making, packaging, testing, metrology and advanced packaging/silicon stacking technologies such as 3DFabric®. It supports a range of end-market platforms including high performance computing, smartphones, automotive electronics, the Internet of Things and digital consumer electronics.

Manufacturing operations are headquartered in Taiwan, where TSMC operates multiple fabs of various wafer sizes including 12-inch (300mm), 8-inch and 6-inch fabs, plus several "Gigafab®" 12-inch fabs. Subsidiaries and manufacturing facilities exist in Nanjing (China), Arizona (USA), and Japan (via the Japan Advanced Semiconductor Manufacturing joint venture). A new facility is under construction in Dresden, Germany for specialty technologies. The company serves hundreds of customers globally and manufactures thousands of unique products with different technologies, with its customer base and product diversity reflecting breadth across geographies and end markets.

Technology · Semiconductors · Semiconductors · Taiwan
Quality
Quality
Momentum
Momentum
Strength
Strength
Entry
Entry: Early reversal
Price is back above SMA 20 near a key long-term level, and the decline has paused. But a single week of stabilization is not yet a durable base. Stronger reversals typically show multi-week sideways action before the new uptrend begins.
Trend
Trend: Hold
The medium-term trend is intact. Price remains above SMA 20, and none of the profit-protection rules have triggered. Keep holding and let the trend work.
Neg. values
Years
Lower P/E (Bear)
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Fair Value
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Analysts
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Price: Financials: Q2 FY2026 / FY2025TTM presentEstimates: , 13 analystsScored as: Standard companyEvidence: LimitedDetails

Freshness

  • Price through:
  • Latest annual period: FY2025 (); filed
  • Latest interim period: Q2 FY2026 (); filed
  • TTM period: ; used by: Quality, Strength
  • Normalized EPS: , 13 analysts
  • Diluted EPS: , 10 analysts
  • Target price: , 20 analysts

Scoring profile

Effective scoring profile: Standard company

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Score evidence

Quality: Score calculated; High confidence; TTM used
Business Momentum: Score calculated; High confidence; TTM not used
Strength: Score calculated; Limited confidence; TTM used
  • Limited confidence for Strength by model design: diluted EPS stood in for normalized EPS.

Sources and adjustments

Remaining score inputs are provider supplied.

  • Debt to operating cash flow: derived by Findx
  • Net debt to EBITDA: derived by Findx

Key stock metrics

Blended P/E  :
29.71
Blended EPS  :
USD 15.21
Blended EPS Yield  :
3.37%
Dividend Yield :
(Trailing 12 months)
0.90%
Buyback Yield :
(Trailing 12 months)
N/A
Market Cap:USD 2,013,560.70 M
EUR 1,758,643.92 M

Valuation basis

Analyst price target
Estim. EPS Growth  :
(2 yr ahead)
43.48%

P/E Values

Upper P/E:
Fair Value P/E  :
Lower P/E:
Market P/E  :

EPS Estimates

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N/A
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About Taiwan Semiconductor Manufacturing Company Limited

Description, revenue sources, strengths and weaknesses

DESCRIPTION

Taiwan Semiconductor Manufacturing Company Limited (TSMC) is primarily a dedicated semiconductor foundry focused on manufacturing integrated circuits for its customers rather than designing or selling chips under its own brand. It offers manufacturing services across a wide spectrum of process nodes - from advanced logic nodes like 2-nanometer (N2), 3-nanometer (N3, including enhanced versions like N3E, N3P, N3X) and 5-nanometer (N5/N5P), to more mature nodes such as 16nm, 28nm, 12-nanometer (12FFC+), and specialty processes including analog, radio frequency (RF), high voltage, embedded non-volatile memory (NVM), and image sensors.

Beyond pure transistor manufacturing, TSMC provides related semiconductor fabrication services under a broader "Foundry 2.0" definition that includes mask making, packaging, testing, metrology and advanced packaging/silicon stacking technologies such as 3DFabric®. It supports a range of end-market platforms including high performance computing, smartphones, automotive electronics, the Internet of Things and digital consumer electronics.

Manufacturing operations are headquartered in Taiwan, where TSMC operates multiple fabs of various wafer sizes including 12-inch (300mm), 8-inch and 6-inch fabs, plus several "Gigafab®" 12-inch fabs. Subsidiaries and manufacturing facilities exist in Nanjing (China), Arizona (USA), and Japan (via the Japan Advanced Semiconductor Manufacturing joint venture). A new facility is under construction in Dresden, Germany for specialty technologies. The company serves hundreds of customers globally and manufactures thousands of unique products with different technologies, with its customer base and product diversity reflecting breadth across geographies and end markets.

ADDITIONAL INFO

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